35mm Thermal Laminate Board

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35mm thermal laminate board. 35 mm gyproc thermaline plus is a gyproc wall board factory bonded to an expanded polystyrene insulant that is both cfc and hcfc free. Take a look at our online stock to find a product that meets your specifications. 9 5mm1 gyproc wallboard factory bonded to an extruded polystyrene insulant that is both cfc and hcfc free meaning zero odp ozone depletion potential and less than 5 gwp global warming potential. Thermal laminate board is typically constructed by combining plasterboard with an insulating solid foam and paper facing.

Gypsum plasterboard with integral vapour control layers for an advanced level of thermal insulation. The expanded polystyrene insulant is then further bonded to the finished plasterboard. Suitable for mechanical fixing or dot and dab fixing this insulated board is consistently sized with extremely tight tolerances ensuring thermal bridging is minimised. Celotex tb4035 is targeted at cut to fit applications between rafters or joists and enables users to achieve lower u values with a single layer of insulation than has previously been possible.

Gypsum plasterboard bonded to an extruded polystyrene foam insulant providing a vapour control layer for an intermediate level of thermal insulation. 35mm warmline pir thermal laminate combines 25mm high performance thermal insulation pir foam bonded to 9 5mm tapered edge plasterboard. Product is designed as a simple and effective way to improve the thermal efficiency in both walls and roof applications. Thermal laminate plasterboard combines the qualities of plasterboard and insulation in one package making it a convenient and affordable choice for many building applications.

The gyproc board consists of an aerated gypsum core encased in and firmly bonded to strong paper liners. 35mm warmline xps thermal laminate comprise high performance extruded polystyrene insulation foam xps bonded to 9 5mm tapered edge plasterboard. Typically it consists of a face of thermal plasterboard combined with foam insulation backing. It is often installed in internal walls ceilings roofs and decks.

The thermal resistance and thermal conductivity of a product is used to calculate the u value of a system. It is also appropriate for use in floors and walls. With low emissivity foil facings tb4035 is manufactured from rigid polyisocyanurate pir using a blend of blowing agents that have zero ozone. 12 5mm gyproc wallboard bonded to cfc and hcfc free meaning zero odp ozone depletion potential high performance polyisocyanurate foam insulant with two integral vapour control layers to reduce the risk of condensation.

Effectively achieving a required u value significantly improves a building s efficiency reducing co 2 emissions and annual energy expenditure. Thermal conductivity 0 022 w mk. U value requirements can vary depending on the building project location and system type.